Electronic component, and method for manufacturing the same

ABSTRACT

An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.

TECHNICAL FIELD

The present invention relates to an electronic component which is usedfor various kinds of electronic equipment, and a manufacturing methodfor the same.

BACKGROUND ART

A conventional electronic component of this type will be described withreference to FIGS. 4A and 4B. FIG. 4A is a perspective view of a circuitprotective element which is an example of the conventional electroniccomponent. FIG. 4B is a sectional view of the circuit protectiveelement, seen along an A-A line in FIG. 4A.

As shown in FIGS. 4A and 4B, the circuit protective element isconfigured by: a base 1; a conductive film 2; a protective film 5; and aplating layer 7. The base 1 is shaped like a pillar, such as a columnand a prism. It is made of any of ceramic, glass, and a mixture ofceramic and glass, which have an insulation characteristic. Theconductive film 2 is made of copper, silver, nickel or the like. It isformed over the entire surface of the base 1. An electrode 6 is formedby each of the portions of the conductive film 2 which are located atboth end portions of the base 1. A plating layer 7 is formed on thesurface of the electrode 6. The protective film 5 is made of epoxy resinor the like. It is formed so as to cover the portion of the conductivefilm 2's surface except its portions located at both end portions of thebase 1.

A portion of the conductive film 2 is cut off by means of laserirradiation or the like. Thereby, a resistance-adjusting groove 3 iscreated in the conductive film 2. It makes substantially one turn sothat its tips overlap each other. The region between the portions inwhich the tip portions of the resistance-adjusting groove 3 overlap eachother is a narrow portion 4. As an electronic component which has such agroove, for example, there is a chip component which is disclosed inJapanese Patent Laid-Open No. 7-307201 specification.

Herein, the conductive film 2 is a portion which fulfills the electricalfunction of the circuit protective element. For example, if anelectronic component is a resistor, it becomes a resistant body. In thecase of the circuit protective element shown in FIGS. 4A and 4B, itturns into a fusing portion with a fusing function. In this case, if anover-current beyond a certain level is applied, the narrow portion 4provided in the conductive film 2 generates heat. Thereby, it is meltedand fused. This breaks the current which is applied on the circuitprotective element.

Next, a manufacturing method will be described for the above describedcircuit protective element. First, over the whole surface of the base 1,the conductive film 2 is formed by means of plating. In this case, theelectrode 6 is formed by the conductive film 2 located at both endportions of the base 1.

Sequentially, the conductive film 2 is irradiated with a laser beam tocut off a portion of the conductive film 2. Thereby, theresistance-adjusting groove 3 is formed which has substantially one turnso that its tips overlap each other. At this time, the narrow portion 4is formed within the region between the overlapped portions in the tipportions of the resistance-adjusting groove 3.

Next, the protective film 5 made of epoxy resin or the like is formed tocover the surface of the conductive film 2 other than the portionslocated at both end portions of the base 1. Finally, the plating layer 7is formed on the surface of the electrode 6.

In the circuit protective element which is manufactured in this way, aresistance value is measured in its manufacturing process, or theresistance-adjusting groove 3 is formed. In order to take such ameasurement, the circuit protective element needs to be held. A chuck ispressed against the electrode 6 so as to come into contact with it.Thereby, the circuit protective element can be held.

At this time, if the contact resistance between the chuck and theelectrode 6 becomes greater, the contact resistance at this portion mayadversely affect the measurement of a resistance value. This makes itimpossible to adjust the resistance value precisely. Therefore, thecontact resistance between the chuck and the electrode 6 has to be madeas low as possible. In order to reduce the contact resistance betweenthe chuck and the electrode 6, the chuck needs to be pressed on theelectrode 6 by a strong force.

On the other hand, in the above described circuit protective element,the conductive film 2 is formed on the entire surface of the base 1.Thereby, the conductive film 2 is united with the electrode 6 which islocated at both end portions of the base 1. In this case, the conductivefilm 2 and the electrode 6 are continuously formed, thus helpingstabilize their electrical and mechanical connection.

However, if the conductive film 2 and the electrode 6 are continuouslyunited, then depending upon the circuit protective element's resistancevalue, the conductive film 2 becomes thinner and the electrode 6 alsothins down. At this time, in order to lower the contact resistancebetween the chuck and the electrode 6, the chuck is pressed against theelectrode 6 by a strong force. Then, the base 1 cannot absorb all themechanical impact at the time when it is pressed, and thus, the cornerportions at both end portions of the base 1 may be chipped. This isbecause the base 1 is made of any of ceramic, glass, and a mixture ofceramic and glass. If the circuit protective element which has such achip in its corner portions is mounted on a printed board or the like,its stable electrical connection cannot be obtained. Hence, the circuitprotective element with any chips in the corner portions has to beremoved, thus deteriorating its yield when manufactured.

DISCLOSURE OF THE INVENTION

It is an object of the present invention to provide an electroniccomponent and its manufacturing method in which even if a chuck ispressed against an electrode located on both end-portion sides of a baseby a strong force for the purpose of holding the electronic component,then the corner portions at both end portions of the base can beprevented from being chipped, and thus, its yield rate can be improved.

An electronic component according to an aspect of the present inventionelectronic component includes: an insulating base; an impact-absorbinglayer which is formed so as to cover at least the corner portions ofboth end portions of the base; and a conductive film which is formed soas to cover at least a portion of the surface of the base and thesurface of the impact-absorbing layer.

In the above described electronic component, even if a mechanical impactis given to both end portions of the base when the electronic componentis held, this mechanical impact can be absorbed into theimpact-absorbing layer. Therefore, in order to hold the electroniccomponent, even if a chuck is pressed, by a strong force, on anelectrode located on both end-portion sides of the base, then the cornerportions at both end portions of the base can be hindered from beingchipped. This helps enhance its yield.

An electronic-component manufacturing method according to another aspectof the present invention includes: a first process of forming animpact-absorbing layer so as to cover at least the corner portions ofboth end portions of an insulating base; and a second process of forminga conductive film so as to cover at least a portion of the surface ofthe base and the surface of the impact-absorbing layer.

In the above described electronic-component manufacturing method, animpact-absorbing layer is formed so as to cover at least the cornerportions of both end portions of an insulating base. Thereafter, aconductive film is formed so as to cover at least a portion of thesurface of the base and the surface of the impact-absorbing layer.Therefore, the impact-absorbing layer can be formed between both endportions of the base and the conductive film. As a result, even if amechanical impact is given to both end portions of the base when theelectronic component is held, this mechanical impact can be absorbedinto the impact-absorbing layer. Therefore, in order to hold theelectronic component, even if a chuck is pressed, by a strong force, onan electrode located on both end-portion sides of the base, then thecorner portions at both end portions of the base can be hindered frombeing chipped. This helps enhance its yield. Besides, theimpact-absorbing layer is formed before the conductive film is formed.Therefore, when the impact-absorbing layer is formed, the conductivefilm which is an element assembly of the electronic component can bekept from being damaged. This prevents the characteristics of anelectric component from being deteriorated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view of a circuit protective element accordingto an embodiment of the present invention. FIG. 1B is a sectional viewof the circuit protective element, seen along an A-A line in FIG. 1A.

FIGS. 2A to 2F are perspective and sectional views of the circuitprotective element shown in FIGS. 1A and 1B, showing its manufacturingmethod and processes.

FIGS. 3A to 3F are perspective and sectional views of the circuitprotective element shown in FIGS. 1A and 1B, showing its manufacturingmethod and processes.

FIG. 4A is a perspective view of a circuit protective element which isan example of a conventional electronic component. FIG. 4B is asectional view of the circuit protective element, seen along an A-A linein FIG. 4A.

BEST MODE FOR IMPLEMENTING THE INVENTION

Hereinafter, a circuit protective element according to an embodiment ofthe present invention will be described with reference to the drawings.FIG. 1A is a perspective view of the circuit protective elementaccording to the embodiment of the present invention. FIG. 1B is asectional view of the circuit protective element, seen along an A-A linein FIG. 1A. Herein, a circuit protective element will be described belowas an example of the electronic component. However, the electroniccomponent to which the present invention is applied is not limitedespecially to this example. Hence, it can be similarly applied tovarious chip components or the like.

The circuit protective element shown in FIGS. 1A and 1B is configuredby: a base 11; an impact-absorbing layer 12; a conductive film 13; aprotective film 17; and a plating layer 18. The base 11 is made of aninsulating mixture of ceramic and glass. It is shaped like a prism, andits section at both ends is thicker than that in the center as if itwere an iron dumbbell.

The impact-absorbing layer 12 is made of copper which is a ductilemetallic material. It is formed by means of electro-less plating withcopper, on the entire surface of both end portions of the base 11, or onboth end surfaces of the base 11 and on side surfaces which extend outfrom both end surfaces. Herein, ductility means an object's property ofthe object itself stretching without being destroyed.

In order to configure the conductive film 13, a metallic film is formedby a sputtering method using titanium and copper. Then, it is platedwith nickel, copper and gold in order. This multi-layer film covers thebase 11 and the whole surface of the impact-absorbing layer 12. In theconductive film 13, the portion which covers the surface of theimpact-absorbing layer 12 is used as an electrode 14.

The portion of the conductive film 13 other than the portions located onboth end-portion sides of the base 11, for example, a portion of itsmiddle portion, is helically cut off using a trimming method such aslaser irradiation. Thereby, a resistance-adjusting groove 15 is formedwhich has substantially one turn so that its tips overlap each other ata predetermined interval. At this time, a narrow portion 16 is formed inthe region between the portions in which the tip portions of theresistance-adjusting groove 15 overlap each other. In the narrow portion16, a fusing portion is formed which functions as a fuse. Thereby, if anover-current beyond a certain level is applied on the circuit protectiveelement, the narrow portion 16 provided in the conductive film 13generates heat. Then, it is melted and fused, thus breaking the currentwhich is given to the circuit protective element.

The protective film 17 is made of epoxy resin or the like. It is formedto cover the entire surface of the middle portion of the conductive film13. Thereby, it protects the portion except the conductive film 13located on both end-portion sides of the base 11. The plating layer 18is made of a nickel plating layer and a tin plating layer. It is formedso as to cover the portion of the conductive film 13 which covers thesurface of the impact-absorbing layer 12, or the surface of theelectrode 14. Herein, in FIG. 1A, the protective film 17 is omitted sothat the resistance-adjusting groove 15 and the narrow portion 16 can beclearly shown.

As described above, in this embodiment, the impact-absorbing layer 12 isprovided so as to cover at least the corner portions of both endportions of the base 11 which is made of a brittle material which is aninsulating mixture of ceramic and glass. Then, the conductive film 13 isformed so as to cover the impact-absorbing layer 12 and the surface ofthe base 11. In the conductive film 13, the portion which covers thesurface of the impact-absorbing layer 12 is used as the electrode 14.

Therefore, when a resistance value is measured, or when theresistance-adjusting groove 15 is formed, in order to hold the circuitprotective element, even if a chuck 100 is pressed, by a strong force,against the electrode 14 located on both end-portion sides of the base11, then the impact-absorbing layer 12 provided between both endportions of the base 11 and the electrode 14 can absorb a mechanicalimpact at the time when it is pressed. Thereby, the corner portions ofboth end portions of the base 11 can be hindered from being chipped,thus improving its yield rate.

In addition, copper which is a ductile metallic material is used as theimpact-absorbing layer 12. Therefore, the above described mechanicalimpact can be certainly absorbed. Besides, the protective film 17 isprovided on the surface of the conductive film 13 so that it covers atleast the resistance-adjusting groove 15. Thereby, theresistance-adjusting groove 15 can also be certainly protected.

Furthermore, the plating layer 18 made of a nickel plating layer and atin plating layer is formed on the surface of the conductive film 13located on both end-portion sides of the base 11. Therefore, the surfacemounting of the circuit protective element can be conducted, thus makingsmaller and thinner a circuit or the like which the circuit protectiveelement is mounted.

Herein, the three-dimensional shape of the base 11 is not limitedespecially to the above described example. Another shape but a prism,for example, a columnar shape, a sheet-like shape or the like may alsobe used. Moreover, without changing its section's thickness at both endsfrom that in the center, the base 11 whose section has the samethickness from one of its ends up to the other may also be used. Inaddition, the sectional shape of the base 11 is not limited especiallyto the above described example. Various shapes can also be used, such asa regular polygon, a circle, a rectangle and an ellipse. Furthermore,the material of the base 11 is not limited especially to the abovedescribed example, either. A single insulating material such as ceramicand glass may also be used. The present invention can be suitably usedfor various insulating brittle materials.

Herein, the method of forming the impact-absorbing layer 12 is notlimited especially to the above described example, either. Variousformation methods, such as another plating method, a sputtering methodand a printing method, can also be used. Furthermore, the material ofthe impact-absorbing layer 12 is not limited especially to the abovedescribed example, either. A ductile metallic material, such as gold,silver, platinum, nickel, chromium, palladium and an alloy of these, canalso be used. Moreover, the portion of the base 11 in which theimpact-absorbing layer 12 is formed is not limited especially to theabove described example, either. The impact-absorbing layer 12 can beprovided in another portion, as long as it coves at least the cornerportions of both end portions of the base 11 which is easily chipped bya mechanical impact, or the portions (i.e., the edge portions of bothend portions) where the end surfaces of the base 11 intersect the sidesurfaces which extend from the end surfaces.

The portion in which the conductive film 13 is formed is not limitedespecially to the above described example, either. There is no need tocover the portion except the electrode 14 located on both end-portionsides of the base 11, or the whole surface of the middle portion of thebase 11. It may also be formed so as to cover only a portion of thesurface of the middle portion of the base 11, or the portion where acurrent concentrated portion is formed which becomes a fusing portionthat embodies a fusing function. In that case, it is continuously unitedwith the electrode 14 located on both end-portion sides of the base 11.In addition, the material and formation method of the conductive film 13are not limited especially to the above described example, either.Various conductive films can be used: only a metallic film is used whichis formed by a sputtering method using titanium and copper; amulti-layer film is used which is formed by plating this metallic filmwith one or two that are chosen from among nickel, copper, gold, silverand the like; or a metallic film is used which is formed by plating thismetallic film with one or more that are chosen from among nickel,copper, gold, silver and the like. A choice among these conductive filmscan be arbitrarily made according to what an electric component is usedfor. The usage purpose includes, for example: determining aresistance-value range; inhibiting the surface of the conductive film 13from oxidizing; prompting the narrow portion 16 made of the conductivefilm 13 to be melted and fused; storing the heat which is generated atthe narrow portion 16; and the like.

The shape of the resistance-adjusting groove 15 is not limitedespecially to the above described example, either. Various shapes canalso be used, for example, a resistance-adjusting groove which is alittle short of substantially one turn is formed in the conductive film13, so that the tips of the groove face each other at an interval and donot overlap each other. Then, the region between the tip portions of theresistance-adjusting groove may also be used as a narrow portion whichmakes up a fusing portion. Furthermore, a resistance-adjusting groovecan be formed in the conductive film 13, so that it makes several turnsaround the base 11. Thereby, it can also be as an electronic componentsuch as an inductor and a resistor. Moreover, the method of forming theresistance-adjusting groove 15 is not limited especially to the abovedescribed example, either. A narrow portion which makes up a fusingportion may also be formed by forming a notch in the conductive film 13by a mechanical cutting method using a trimming blade or the like.

In addition, the material of the protective film 17 is not limitedespecially to the above described example, either. Another resin mayalso be used, such as a phenol resin, a polyimide resin and a siliconeresin. Besides, a denatured resin of each of these, also including anepoxy resin, may also be used. Furthermore, the position in which theprotective film 17 is formed is not limited especially to the abovedescribed example, either. It does not necessarily cover the entiresurface of the middle portion of the conductive film 13, as long as itcovers at least the position where the resistance-adjusting groove 15 isformed.

Next, the manufacturing method for the circuit protective element shownin FIGS. 1A and 1B will be described in further detail. FIGS. 2A to 2Fand FIGS. 3A to 3F illustrate a manufacturing process for explaining themanufacturing method of the circuit protective element shown in FIGS. 1Aand 1B. Herein, FIGS. 2A, 2C, 2E and FIGS. 3A, 3C, 3E are perspectiveviews of the circuit protective element shown in FIGS. 1A and 1B in eachmanufacturing process. FIGS. 2B, 2D, 2F and FIGS. 3B, 3D, 3F aresectional views of the circuit protective element, seen along the A-Aline in FIGS. 2A, 2C, 2E and FIGS. 3A, 3C, 3E.

First, with reference to FIGS. 2A and 2B, a resist film 19 is formed onthe whole surface except both end portions of the base 11 which is madeof an insulating mixture of ceramic and glass. Next, theimpact-absorbing layer 12 made of copper is formed by electro-lessplating, so that it covers the whole surface of both end portions of thebase 11 other than the resist film 19. Herein, in the case where theimpact-absorbing layer 12 or the conductive film 13 is formed byelectro-less plating, preferably, in advance, the entire surface of thebase 11 should be etched and undergo an activation treatment which has acatalytic action for electro-less plating.

Sequentially, as shown in FIGS. 2C and 2D, the resist film 19 is removedfrom the base 11. At this time, the resist film 19 and the portion ofthe impact-absorbing layer 12 which adheres to the resist film 19 aresimultaneously removed. As a result, the impact-absorbing layer 12remains only in both end portions of the base 11. Hence, in its portionother than this, the surface of the base 11 is exposed.

Next, as shown in FIGS. 2E and 2F, the conductive film 13 is formed soas to cover the entire surface of the portion of the base 11 which isexposed by removing the resist film 19 and the portion of theimpact-absorbing layer 12 that adheres to the resist film 19 at the sametime, as well as the whole surface of the impact-absorbing layer 12. Asthe conductive film 13, a metallic film is formed by a sputtering methodusing titanium and copper. Then, it is plated with nickel, copper andgold in order. At this time, in the conductive film 13, the portionwhich covers the surface of the impact-absorbing layer 12 is used as theelectrode 14. Thereby, the conductive film 13 is united with theelectrode 14 which is located at both end portions of the base 11. Thismakes the conductive film 13 and the electrode 14 continuous. In thiscase, the conductive film 13 and the electrode 14 are continuouslyformed, thus helping stabilize the electrical and mechanical connectionof the conductive film 13 to the electrode 14.

Sequentially, as shown in FIGS. 3A and 3B, a portion of the conductivefilm 13 is cut off by means of laser irradiation. Thereby, theresistance-adjusting groove 15 is formed which makes substantially oneturn so that its tips overlap each other. At this time, a narrow portion16 is formed in the region between the portions in which the tipportions of the resistance-adjusting groove 15 overlap each other.

Next, as shown in FIGS. 3C and 3D, the protective film 17 which is madeof epoxy resin or the like is formed so as to cover the portion of theconductive film 13's surface except its portions located at both endportions of the base 11. Lastly, as shown in FIGS. 3E and 3F, theplating layer 18 which is made of a nickel plating layer and a tinplating layer is formed on the surface of the electrode 14.

In the above described manufacturing method for the circuit protectiveelement, the impact-absorbing layer 12 is formed so as to cover both endportions of the insulating base 11. Thereafter, the conductive film 13is formed so as to cover the surfaces of the base 11 and theimpact-absorbing layer 12. Therefore, the impact-absorbing layer 12 canbe formed between both end portions of the base 11 and the electrode 14.Consequently, even if a mechanical impact is applied on both endportions of the base 11 when the circuit protective element is held,this mechanical impact can be absorbed into the impact-absorbing layer12. Therefore, in order to hold the circuit protective element, even ifa chuck 100 is pressed, by a strong force, on the electrode 14 locatedon both end-portion sides of the base 11, then the corner portions atboth end portions of the base 11 can be prevented from being chipped.This helps improve its yield rate.

In addition, the impact-absorbing layer 12 is formed before theconductive film 13 is formed. Therefore, when the impact-absorbing layer12 is formed, the conductive film 13 which is an element assembly of anelectronic component or the portion which fulfills the electricalfunction of the circuit protective element can be kept from beingdamaged. This prevents the characteristics of the circuit protectiveelement from getting worse.

Furthermore, after the resist film 19 is formed on the whole surfaceother than both end portions of the base 11 which is made of aninsulating mixture of ceramic and glass, the impact-absorbing layer 12is formed so as to cover the entire surface of both end portions of thebase 11. Thereafter, the resist film 19 is separated from the base 11.Therefore, the impact-absorbing layer 12 can be prevented from going outof the middle portion of the base 11, or the portion in which there isno need to provide the impact-absorbing layer 12. This makes it possibleto form the impact-absorbing layer 12 precisely at the portion where itneeds to be provided.

Herein, in the above described manufacturing method for the circuitprotective element, the impact-absorbing layer 12 is formed only in bothend portions of the insulating base 11 by an electro-less platingmethod. However, the impact-absorbing layer 12 may also be formed tocover on the whole surface of the resist film 19 by a sputtering methodand the entire surface of both end portions of the base 11. In thatcase, if the resist film 19 is removed, the impact-absorbing layer 12formed on the resist film 19 is also removed simultaneously. Therefore,in the same way as the case where the impact-absorbing layer 12 isselectively formed by means of electro-less plating, theimpact-absorbing layer 12 can be formed only in both end portions of theinsulating base 11.

INDUSTRIAL APPLICABILITY

As described so far, according to the present invention, animpact-absorbing layer is provided so as to cover at least the cornerportions of both end portions of a base which is made of any of ceramic,glass, and a mixture of ceramic and glass, which have an insulationcharacteristic. In addition, a conductive film is formed so as to coverthe surface of this impact-absorbing layer and the surface of the base.In this conductive film, the portion which covers the surface of theimpact-absorbing layer is used as an electrode. Therefore, when aresistance value is measured, or when a resistance-adjusting groove isformed, in order to hold an electronic component, even if a chuck ispressed, by a strong force, against the electrode located on bothend-portion sides of the base, then the impact-absorbing layer betweenboth end portions of the base and the electrode formed on bothend-portion sides of the base by a portion of the conductive film canabsorb its mechanical impact. Thereby, the corner portions of both endportions of the base can be prevented from being chipped, thus improvingits yield rate.

1. An electronic component for performing an electrical function in acircuit, the electronic component comprising: an insulating base; animpact-absorbing layer formed so as to cover at least a corner portionof an end portion of the base and which absorbs a mechanical impact froma chuck applied to the end portion of the base to prevent the endportion of the base from chipping; and an electrically conductive filmformed so as to be in direct contact with at least a portion of asurface of the base and a surface of the impact-absorbing layer andwhich performs the electrical function of the electronic component,wherein the electrically conductive film includes a first portion and asecond portion, the first portion being in direct contact with thesurface of the impact-absorbing layer, and being used as an electrode,the second portion being a resistance film and being formed in aseparate portion of the electrically conductive film from the firstportion and being in direct contact with the surface of the base, thefirst and second portions being formed so as to be continuous, such thatthe second portion extends substantially along an area between the firstand second ends, and the impact-absorbing layer is disposed between theend portion of the base and the portion of the electrically conductivefilm being used as an electrode, wherein the impact-absorbing layer ismade of a ductile metallic material, wherein the impact-absorbing layeris formed on both end surfaces of the base and on side surfaces whichextend out from both end surfaces, and wherein when the resistance filmis formed, the impact-absorbing layer absorbs the mechanical impact fromthe chuck applied to the electrode to prevent the end portion of thebase from chipping.
 2. The electronic component according to claim 1,wherein the base is made of one of ceramic, glass, and a mixture ofceramic and glass.
 3. The electronic component according to claim 1,further comprising a resistance-adjusting groove which is formed in thesecond portion of the electrically conductive film.
 4. The electroniccomponent according to claim 3, wherein a narrow portion which is formedbetween tip portions of the resistance-adjusting groove is a fusingportion which serves as a fuse.
 5. The electronic component according toclaim 4, wherein the electronic component is a circuit protectiveelement.
 6. The electronic component according to claim 3, furthercomprising a protective film which is formed on the surface of theelectrically conductive film so as to cover at least theresistance-adjusting groove.
 7. The electronic component according toclaim 3, wherein the resistance-adjusting groove is formed such that theelectrically conductive film performs as a resistor as the electricalfunction of the electronic component.
 8. The electronic componentaccording to claim 3, wherein the resistance-adjusting groove is formedsuch that the electrically conductive film performs as an inductor asthe electrical function of the electronic component.
 9. The electroniccomponent according to claim 3, wherein the resistance-adjusting grooveis formed such that the electrically conductive film performs as a fuseas the electrical function of the electronic component.
 10. Theelectronic component according to claim 3, wherein at least a portion ofthe resistance-adjusting groove is formed so as to be disposedapproximately equidistant from the first and second ends.
 11. Theelectronic component according to claim 1, further comprising a platinglayer formed on the portions of the electrically conductive film thatare located on both-end sides of the base.
 12. An electronic-componentmanufacturing method, wherein the electronic component performs anelectrical function in a circuit, the method comprising: a first processof forming an impact-absorbing layer which absorbs a mechanical impactapplied from a chuck to both end portions of an insulating base so as tocover at least a corner portion of an end portion of the insulating baseso as to prevent the end portion of the insulating base from chipping;after the first process, a second process of forming an electricallyconductive film so as to be in direct contact with at least a portion ofa surface of the base and a surface of the impact-absorbing layer, theelectrically conductive film performing the electrical function of theelectronic component; and chucking the substrate only after theimpact-absorbing layer is formed to avoid chipping of the insulatingbase, wherein the electrically conductive film includes a first portionand a second portion, the first portion being in direct contact with thesurface of the impact-absorbing layer, and being used as an electrode,the second portion being a resistance film and being formed in aseparate portion of the electrically conductive film from the firstportion and being in direct contact with the surface of the base, thefirst and second portions being formed so as to be continuous, such thatthe second portion extends substantially along an area between the firstand second ends, and the impact-absorbing layer is disposed between theend portion of the base and the portion of the electrically conductivefilm being used as an electrode, wherein the impact-absorbing layer ismade of a ductile metallic material, wherein the impact-absorbing layeris formed on both end surfaces of the base and on side surfaces whichextend out from both end surfaces, and wherein when the resistance filmis formed, the impact-absorbing layer absorbs the mechanical impact fromthe chuck applied to the electrode to prevent the end portion of thebase from chipping.
 13. The electronic-component manufacturing methodaccording to claim 12, wherein the first process includes: forming aresist film on the surface of the base except on the end portion of thebase; and forming the impact-absorbing layer so as to cover a surface ofthe end portion of the base; and the second process includes: removingthe resist film from the surface of the base, and forming theelectrically conductive film so as to be in direct contact with at leasta portion of the surface of the base which is exposed after the resistfilm is removed, and the surface of the impact-absorbing layer.
 14. Theelectronic-component manufacturing method according to claim 12, whereinthe first process includes forming the impact-absorbing layer so as tocover at least the corner portion of the end portion of the base whichis made of one of ceramic, glass, and a mixture of ceramic and glass.15. The electronic-component manufacturing method according to claim 12,further comprising a third process of forming a resistance-adjustinggroove in the second portion of the electrically conductive film. 16.The electronic-component manufacturing method according to claim 15,wherein the third process includes creating a fusing portion whichserves as a fuse by forming a narrow portion between tip portions of theresistance-adjusting groove.
 17. The electronic-component manufacturingmethod according to claim 15, further comprising a fourth process offorming a protective film on the surface of the electrically conductivefilm so as to cover at least the resistance-adjusting groove.
 18. Theelectronic-component manufacturing method according to claim 17, furthercomprising a fifth process of forming a plating layer on portions of theelectrically conductive film that are located on both-end sides of thebase.
 19. The electronic-component manufacturing method according toclaim 15, wherein at least a portion of the resistance-adjusting grooveis formed so as to be disposed approximately equidistant from the endportion of the base and another end portion of the base opposite the endportion of the base.